Chip Design
AuraStack AI Super Agent

Cadence Introduces AuraStack AI Super Agent, the World’s First Agentic AI Platform for PCB and Advanced Packaging

August 2, 2026 by Adrian Rodriguez 0

Cadence (Nasdaq: CDNS) today introduced the AuraStack™ AI Super Agent on Cadence® Allegro® AI Studio, the world’s first agentic AI platform for...

Cadence

Cadence and Google Team Up to Supercharge AI‑Driven Chip Design via the ChipStack AI Super Agent on Google Cloud

April 30, 2026 by Adrian Rodriguez 0

Integration of Google’s Gemini models with Cadence ChipStack AI Super Agent accelerates next-generation, agent-driven design automation Cadence, an...