MediaTek Expands Cloud-to-Edge Leadership with Next-Generation Connectivity and AI at MWC 2025  

At Mobile World Congress 2025, MediaTek is showcasing   several key technologies that enable wireless evolution towards 6G, including hybrid computing, a live LEO broadband NR-NTN trial, sub-band full duplex (SBFD), along with the new M90 5G Advanced   modem. In addition, the company is also sharing its latest developments in Dimensity Auto and   Dimensity Smartphone SoCs. The newest MediaTek-powered devices from some of the world’s leading brands will be on display at their booth in Hall 3. 

“We’re pushing forward industry-leading connectivity and AI applications through high-quality   products and global standardization, which create significant new opportunities to enrich everyday   living for more people around the world,” said Joe Chen, President of MediaTek. “This is exemplified by our most recent developments in leading-edge 6G-era technologies, generative AI hybrid computing, and 5G-Advanced solutions, which will be on display this week.”   

Enabling 6G with Integrated Communications & Computing  

MediaTek is demonstrating its Hybrid Computing innovation (Integrated Communication &   Computing) that brings together a device cloud + RAN as an ‘edge cloud’, a key technology   component proposed for upcoming 6G standardization, that extends ambient computing from device   to RAN, achieving low latency in activities such as Generative AI (Gen-AI), carrier-grade privacy &   personal data governance, and dynamic computing resource scheduling. The implementations are exhibited in collaboration with NVIDIA, Intel and G REIGNS, respectively.    

Ultra Power-Efficient Envelope Assisted RFFE positioned for next-generation wireless products  

MediaTek’s Envelope Assisted RFFE System increases power amplifier efficiency by 25%, reducing   device heating rate, widening addressable bandwidth by over 100MHz in the same power envelope,   and allowing higher power delivery for wider coverage.   

Sub-Band Full Duplex for efficient use of 6G spectrum  

Sub-Band Full Duplex (SBFD), a key physical layer technology applicable to 5G-Advanced and 6G, will   feature unprecedented improvements in unpaired TDD spectrum, significantly boosting uplink   coverage and reducing latency. Both factors are key enablers of new services. In cooperation with   Keysight, MediaTek is demonstrating a major technological breakthrough: Mitigating self-interference   of SBFD, which is particularly problematic in small devices such as smartphones because of the   proximity of the transmitting and receiving antennas.  

MediaTek M90 5G Advanced Modem  

The upcoming M90 5G-Advanced modem will deliver speeds of up to 12Gbps, support for 3GPP-  standard Release 17 and the forthcoming Release 18 specifications, simultaneous FR1+FR2   connectivity, and a novel Smart Antenna technology that leverages AI to enable user scenario   identification and significantly boosts data throughput. The M90 utilizes MediaTek UltraSave technology, which reduces average power consumption by up to 18% compared to the previous  generation modem. During MWC 2025, MediaTek will show it has achieved an industry-leading 10Gbps throughput using FR1 3CC + FR2 8CC using an M90-based device on a live Ericsson network configuration.  

Smart AI Antenna   

The M90 modem supports Smart AI Antenna, which provides native body proximity sensing without requiring external sensors. The feedback response and intelligent signal analysis can detect how the   device is held, as well as its network environment, and it will actively tune the antenna and uplink   power to ensure that signal quality is maintained. MediaTek will demonstrate Smart AI Antenna in   collaboration with Anritsu at MWC 2025. 

Intelligent CPE: Generative AI Gateway  

MediaTek is exhibiting its Generative AI infrastructure, consisting of a Gateway and Context   Synchronization system. This decentralizes Gen-AI capabilities beyond smartphones and smart home devices, providing Gen-AI functionality to all connected devices. It enhances device capabilities while fostering wider adoption and new service opportunities, all without compromising data privacy and   security. 

The latest MediaTek-powered CPE devices and modules are also on display from partners. Unique   technologies on display include a 1.9x uplink performance boost achieved through three   transmission antennas (3TX), applicable across 5G NR band combinations, as well as Low-Latency,   Low-Loss, and Scalable throughput (L4S), which reduces network latency by over 20x and minimizes   packet loss. These advancements greatly enhance the user experience compared to legacy designs. 

Next Generation Satellite (NTN) Connectivity  

At the show, MediaTek will present its continuing industry leadership in 5G-Advanced Non-Terrestrial   Network (NTN) technology. This next generation of satellite connectivity – Ku-band NR-NTN – will bring a future of ubiquitous broadband connectivity to 5G devices. This follows a recent successful   field trial of Ku-band NR-NTN over commercial OneWeb sLow Earth Orbit (LEO) satellite. The field   trial was conducted with Eutelsat infrastructure, AIRBUS in-orbit satellites connecting to a MediaTek   Ku-band NR-NTN test chip, ITRI NR NTN test gNB, and Sharp array with support by Rodhe & Schwartz   testing equipment.  

MediaTek Dimensity Auto  

With rapid progress in automotive, MediaTek’s Dimensity Auto development platform will be at the   show, highlighting its leading capabilities in multimedia, 3D graphics, and AI processing capabilities   across multiple virtual machines (VMs) on a hypervisor. The innovative eCockpit features an 8K   display, and is developed in collaboration with strategic partners, illustrating what people can expect   from next-generation in-vehicle experiences.  

MediaTek Dimensity 9400  

Various smartphones powered by the flagship Dimensity 9400 5G chip will be showcased,   demonstrating their leading-edge Generative and Agentic AI applications and services. The showcase will also include the latest advancements in photography and videography, such as AI Audio Focus, AI   Telephoto, Best Snapshot capabilities, AI Depth Engine for video playback, and the newest feature   rich games with ray-traced graphics.  

224G SerDes for ASIC  

MediaTek’s 224G SerDes represents a significant advancement in technology leadership, offering   exceptional performance, reliability, and efficiency. This solution is designed to meet the rigorous   interconnect demands of AI, hyperscale computing, data centers, and networking infrastructure. Our   SerDes expertise is integral to our ASIC offerings, driving the next generation of AI acceleration and   many other interconnect applications. MediaTek SerDes solutions empower ASIC customers with   advanced process technology that enhances performance and bandwidth density, making them both   power-friendly and cost-effective. 

These 224G SerDes solutions are silicon-proven, and development of the next-generation SerDes is   already underway. MediaTek collaborates with major foundries on the most advanced process nodes,   chip-to-chip interconnect, high-speed I/O, on-package memory, and ultra-large package design. This   effort also enables MediaTek to optimize performance, power, and area (PPA) through Design   Technology Co-Optimization (DTCO) to best fit customers’ domain specific requirements. 

To learn more about MediaTek at MWC 2025, please stop by our booth #3D10 or visit:   https://www.mediatek.com   

About MediaTek Inc.  

MediaTek Incorporated (TWSE: 2454) is a global fabless semiconductor company that enables nearly   2 billion connected devices a year. We are a market leader in developing innovative systems-on-chip   (SoC) for mobile, home entertainment, connectivity and IoT products. Our dedication to innovation   has positioned us as a driving market force in several key technology areas, including highly power-  efficient mobile technologies, automotive solutions and a broad range of advanced multimedia   products such as smartphones, tablets, digital televisions, 5G, Voice Assistant Devices (VAD) and   wearables. MediaTek empowers and inspires people to expand their horizons and achieve their goals   through smart technology, more easily and efficiently than ever before. We work with the brands you love to make great technology accessible to everyone, and it drives everything we do. Visit   www.mediatek.com for more information.  

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